Power Electronics Building Gan Hemts on 200 Mm Silicone.
Contents:
Chapter 1: Simpler die boost battery life.
Chapter 2: Faster emitter eye chip-to-chip interconnects.
Chapter 3: Scrutinizingsurfaces with novel inspection tools.
Chapter 4: Insider reveals how to succeed in this sector.
Chapter 5: Uncoveringimperfections inLED packages.
Chapter 6: Unconventional technique yields dislocation free material.
Chapter 7: Adding InGaN combats droop.
Book Dscription:
Power Electronics Building Block (PEBB) is a broad concept that integrates the progressive integration of power devices, gate motors, and other components into building blocks, with clearly defined functions that provide multi-application interface capabilities.
This building block approach results in lower costs, losses, weight, size and engineering effort for the application and maintenance of energy electronics systems. Based on the functional specification of PEBB and the performance requirements of the intended applications, the PEBB designer processes details of machine stress, inertial induction, speed switching, thermal management,loss, protection, control interfaces, required variable measurements, and potential integration issues at all levels.
Improving the foundations:
GREAT FOUNDATIONS underpin great structures. And when they are not there, what you build can rapidly deteriorate, with cracks and defects appearing before the entire structure finally falls apart.
You can see this happening in many different situations, from the sandcastles that I built with my family this summer to the vast array of compound semiconductor devices developed and manufactured by our community.
The devices with the fewest defects are underpinned with the most established substrates – GaAs and InP. The material quality of both of these platforms is incredibly high, and today’s manufacturers of these products focus on improving yield and bringing down cost, rather than developing revolutionary technologies for boule growth.
Substrates made from wide bandgap materials are far less mature, sell for significantly higher prices, and often contain more imperfections. But quality will improve as crystal growers refine their technologies and equipment manufacturers introduce new tools to scrutinise substrates. One metrology firm that has recently produced tools for inspecting SiC substrates is LaserTec. Its pieces of equipment feature the combination of confocal microscopy and differential interferometry, and they are claimed to expose incredibly shallow scratches and small pits on the sample surface.
Although this tool will help to increase the quality of SiC substrates – they can exhibit a variety of defects, including those with esoteric names, such as triangles and carrots – the biggest opportunity for improvement lies with GaN. Dislocations in typical substrates number more than a million per square centimetre, and it appears that the only way to bring this figure down by several orders of magnitude is to turn to a new technology for forming boules.
One attractive option that can banish dislocations has recently been unveiled by researchers at Osaka University, Japan (see page 53). Engineers begin by taking a film of GaN grown on sapphire, placing a sapphire substrate with millimetre-sized apertures on top, and inserting this combination in a stainless steal tube. This is filled with a metal melt of gallium, sodium and carbon, plus nitrogen gas at a pressure of 3.6 MPa. GaN seeds form in the apertures, and can grow and coalesce to yield high-quality, defect free crystals. So far, these are only a few millimetres in size, but the Japanese engineers have set their sights on producing 8-inch material.
If they succeed, this could revolutionize GaN substrate manufacture. And in the meantime, asthey build devices on their small pieces of dislocation-free GaN, they will answer a question that has intrigued and evaded us for many years: How much better is a GaN device when it is built on a perfect foundation? I’ll leave you to ponder the answer to that.
Dr Richard Stevenson
Editor
Book Details:
⏩Edition: 3nd edition
⏩Editor: Dr Richard Stevenson
⏩Puplication Date: 2012
⏩Language: English
⏩Pages: 131
⏩Size: 5.89 MB
⏩Format: PDF
Download Power Electronics Building Gan Hemts on 200 Mm Silicone Edited by Richard Stevenson in pdf format for free.
